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COMSOL on Twitter: "Learn how to model thermal contact resistance between an electronic package and a heat sink: http://t.co/fUJvhftzew http://t.co/oRO0koI7AE" / Twitter
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Optimization of fins arrangements for the square light emitting diode (LED) cooling through nanofluid-filled microchannel | Scientific Reports
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Heat transfer COMSOL Multiphysics Thermal conduction Fluid, Thermal Fluids, solid, comsol Multiphysics, thermal Fluids png | PNGWing
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PDF] Multi-Objective Optimization of a Strip-Fin Microchannel Heatsink: Integrating COMSOL Multiphysics with modeFRONTIER | Semantic Scholar
![Figure 2: Overview of the COMSOL Desktop. Simulation of a common heat sink is shown, where fluid dynamics and heat transfer are coupled. - Polytechnic Hub Figure 2: Overview of the COMSOL Desktop. Simulation of a common heat sink is shown, where fluid dynamics and heat transfer are coupled. - Polytechnic Hub](https://www.polytechnichub.com/wp-content/uploads/2015/02/comsol2.png)
Figure 2: Overview of the COMSOL Desktop. Simulation of a common heat sink is shown, where fluid dynamics and heat transfer are coupled. - Polytechnic Hub
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